| 摘要 |
According to the present invention, a heat-generating element (101), a porous metal body (102), and a metal composition (105) are prepared (preparation step). The heat-generating element (101) is, for example, a power semiconductor that generates a large amount of heat. The porous metal body (102) has a plurality of pores (80). The metal composition (105) is in paste form. The metal composition (105) includes a metal component (110) and an organic component (108). The metal component (110) comprises a Sn powder (106) and a CuNi alloy powder (107). The metal composition (105) paste is provided between the heat-generating element (101) and the porous metal body (102) (installation step). Then, the metal composition (105) is heated in accordance with a temperature profile using, for example, a reflow device (heating step). |
