| 摘要 |
Disclosed are a board assembly and cabinet. The board assembly comprises: one or more devices to undergo heat dissipation; a board body mounted with the devices to undergo heat dissipation on a board surface; a panel fixed at an outer board edge of the board body and having an inner board surface facing towards the devices to undergo heat dissipation; and a cover board mounted on the board body, wherein two opposite board surfaces of the board body are spaced from the cover board, the devices to undergo heat dissipation are between the cover board and the two opposite board surfaces of the board body, and the cover board does not protrude from the panel in a direction perpendicular to the board surface of the board body. |
