METHODS OF MANUFACTURING MULTI DIE SEMICONDUCTOR DEVICE PACKAGES AND RELATED ASSEMBLIES

摘要

Methods of making semiconductor device packages may involve attaching a first semiconductor die to a carrier wafer, an inactive surface of the first semiconductor die facing the carrier wafer. One or more additional semiconductor die may be stacked on the first semiconductor die on a side of the first semiconductor die opposite the carrier wafer to form a stack of semiconductor dice. A protective material may be positioned over the stack of semiconductor dice, a portion of the protective material extending along side surfaces of the first semiconductor die to a location proximate the inactive surface of the first semiconductor die. The carrier wafer may be detached from the first semiconductor die.

主权项

1. A method of making a semiconductor device package, comprising:
attaching a first semiconductor die to a carrier wafer with an attachment material; stacking at least one additional semiconductor die on the first semiconductor die on a side of the first semiconductor die opposite the carrier wafer; positioning a protective material over at least sides of the stack of semiconductor dice, a portion of the protective material extending contiguously along all side surfaces of the at least one additional semiconductor die and along side surfaces of the first semiconductor die to a location in contact with the attachment material at least proximate a surface of the first semiconductor die facing the carrier wafer; and detaching the carrier wafer from the first semiconductor die.