| 发明名称 |
WAFER LEVEL PACKAGE AND FABRICATION METHOD THEREOF |
| 摘要 |
A semiconductor device includes an interposer having a first side and a second side opposite to the first side, at least one active chip mounted on the first side within a chip mounting area through a plurality of first bumps, at least one dummy chip mounted on the first side within a peripheral area being adjacent to the chip mounting area, a molding compound disposed on the first side. The molding compound covers the at least one active chip and the at least one dummy chip. A plurality of solder bumps is mounted on the second side. |
| 申请公布号 |
US2016358865(A1) |
申请公布日期 |
2016.12.08 |
| 申请号 |
US201514730231 |
申请日期 |
2015.06.03 |
| 申请人 |
Inotera Memories, Inc. |
发明人 |
Shih Shing-Yih;Shih Neng-Tai |
| 分类号 |
H01L23/00;H01L23/498 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device, comprising:
an interposer having a first side and a second side opposite to the first side; at least one active chip mounted on the first side within a chip mounting area through a plurality of first bumps; at least one dummy chip mounted on the first side within a peripheral area being adjacent to the chip mounting area; a molding compound disposed on the first side, the molding compound covering the at least one active chip and the at least one dummy chip; and a plurality of solder bumps mounted on the second side. |
| 地址 |
Taoyuan City TW |
