发明名称 |
HIGH THERMAL CONDUCTIVITY WAFER SUPPORT PEDESTAL DEVICE |
摘要 |
A support pedestal device for an electrostatic chuck includes a base housing defining an internal cavity, and a base insert disposed proximate the internal cavity of the base housing. A fluid pathway is formed in the internal cavity and includes a plurality of linear-parallel cooling channels separated by corresponding plurality of linear-parallel cooling fins, a fluid supply channel, and a fluid return channel. A cooling fluid flows through the fluid supply channel, through the plurality of linear- parallel cooling channels, and back through the fluid return channel to cool the support pedestal device. |
申请公布号 |
WO2016197083(A1) |
申请公布日期 |
2016.12.08 |
申请号 |
WO2016US35970 |
申请日期 |
2016.06.06 |
申请人 |
WATLOW ELECTRIC MANUFACTURING COMPANY |
发明人 |
ATLAS, Boris;NOSRATI, Mohammad;SMITH, Kevin, R.;AMES, Ken;PTASIENCKI, Kevin |
分类号 |
H01L21/67;F26B25/00;H02H1/00;H02N13/00 |
主分类号 |
H01L21/67 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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