| 摘要 |
An MEMS pressure sensor and an MEMS inertial sensor integration structure. A first lower electrode (3a) and a first upper electrode (4a) form an air pressure sensitive capacitor, a second lower electrode (3b) and a second upper electrode (4b) form a reference capacitor, an inertia sensitive structure (4c) and a fixed electrode plate form an inertia detection capacitor, and a cover body (8) packages the inertia detection capacitor on a substrate. By means of the integration structure, an MEMS inertial sensor and an MEMS pressure sensor are integrated on a same substrate, and packaging of a whole chip can be completed through one-step packaging, thereby reducing the cost of chip packaging. |
