| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having an excellent electric characteristic, durability, and reliability. <P>SOLUTION: In the semiconductor device, a sheet-form heat radiating insulator 14 is interposed connectively between a conductor 15 with a semiconductor 106 mounted thereon, and a heat radiator 12, and insulating resins 16 are so disposed in both the end portions of the conductor 15 for mount as to contact them with both the ends. Consequently, the high heat radiating quality of the device and its excellent electric characteristic are made compatible with each other. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
