| 摘要 |
<P>PROBLEM TO BE SOLVED: To appropriate store a plurality of kinds of semiconductor devices with different thicknesses. <P>SOLUTION: This tray is equipped with a tray member 2 and a frame member 3 arranged thereon. The tray member 2 can be mounted on the frame member 3, and has a plurality of semiconductor mounting parts 12 on which semiconductor devices 4 can be mounted. A semiconductor storing part 5 is formed between the semiconductor mount parts 12 of both tray members 2 arranged up and down through the frame member 3. On the tray members 2 and the frame member 3, fitting projects 13 and fitting recesses 23 for fitting both these members together are provided. The fitting projects 13 and the fitting recesses 23 can fix the frame member 3 to the tray members 2 at different height positions in accordance with the thicknesses of the semiconductor devices 4. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
