| 摘要 |
A multilayer capacitor (2) consisting of a capacitor body (1) and an interposer board (20) arranged underneath it, wherein a pair of land patterns are arranged on a front surface of the interposer board (20) for connection with a pair of terminal electrodes of the capacitor body (11) and (12), and a pair of external electrodes are arranged on a back surface of the interposer board (20) for connection with interconnect patterns (34) of a mounting board (33) by solder (35), the pair of land patterns and the pair of external electrodes being arranged on the interposer board (20) so that a direction of a line connecting the pair of land patterns and a direction of a line connecting the pair of external electrodes intersect perpendicularly.
|
