发明名称 電子機器モジュール
摘要 An electronic device module includes a metallic casing having at least one boss formed therein, an electronic device unit placed inside the casing, connector terminals for external device connection electrically connected to the electronic device unit, and a metallic ground shell disposed so as to surround the connector terminals, having a front surface covered with a metal coated layer and including at least one boss insertion portion formed, a head of the at least one boss inserted into the at least one boss insertion portion and the coated layer positioned on a periphery of the corresponding at least one boss insertion portion being welded to each other to electrically connect and fix the ground shell to the casing.
申请公布号 JP6039514(B2) 申请公布日期 2016.12.07
申请号 JP20130156623 申请日期 2013.07.29
申请人 日本航空電子工業株式会社 发明人 内山 勇一;樋口 真佐央;石和 正;新田 正義
分类号 H01R13/6581;H01R13/52;H04N5/225;H05K9/00 主分类号 H01R13/6581
代理机构 代理人
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