| 摘要 |
PROBLEM TO BE SOLVED: To reduce a time necessary for confirmation of electrical conduction between a probe and a via.SOLUTION: A semiconductor device manufacturing method comprises: a process of bringing a probe in contact with a via connected to a gate which is not electrically connected with a substrate on which a source, a drain and the gate are formed; a process of applying a DC pulse voltage to the gate to measure electrical characteristics; and a process of determining whether the probe and the via connected to the gate are electrically conductive based on the measured electrical characteristics. |
