发明名称 半導体装置、該装置に用いられる実装基板及び該実装基板の製造方法
摘要 [Problem to be Solved] A semiconductor element having fine pitch electrodes is mounted on a substrate at low cost without reducing the number of input-output terminals. [Solution] Electrodes 1 for electrical connection and first inductors 2, arranged between the electrodes 1 in a manner neighboring the electrodes 1, for electromagnetic coupling are arranged on one main surface of the semiconductor element 3. On a substrate 5, second inductors 4 for electromagnetically coupling with the first inductors 2 are arranged in positions corresponding to the first inductors 2. The semiconductor element 3 is mounted on the substrate 5 so that the first and second inductors 2 and 4 face each other. Only desired input/output signals among input/output signals of the semiconductor element 3 are inputted or outputted from the external electrodes 11 of the substrate 5 in a manner being transmitted contactlessly by electromagnetic coupling between the first and second inductors 2 and 4 without going through the electrodes 1.
申请公布号 JP6039182(B2) 申请公布日期 2016.12.07
申请号 JP20110520939 申请日期 2010.06.23
申请人 日本電気株式会社 发明人 田子 雅基
分类号 H01L23/12;H01L25/065;H01L25/07;H01L25/18 主分类号 H01L23/12
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