| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor element such as a diode or the like, which is not broken even though the element is used at places where a temperature difference is remarkable. SOLUTION: A diode is constituted in a structure that a slit 15 is provided in an electrode plate 13 connected with an anode electrode on a chip part 12. A thermal stress is absorbed in this slit 15.</p> |
