| 摘要 |
PROBLEM TO BE SOLVED: To provide a long light emitting device which efficiently releases heat generated from a semiconductor light emitting element such as an LED and is suitably used in a downlight type backlight and a light emitting device for a lighting device.SOLUTION: In a light emitting device 100, multiple mounting parts 6A corresponding to parts of a metal part 6 are provided in multiple recessed parts 10 on a substrate 1 and multiple LED chips 7 are mounted on the multiple mounting parts 6A. All of or at least parts of the mounting parts 6A are exposed from a resin part 3 on the rear surface side of the substrate 1. Further, a resin seal part 2 filling each recessed part 10 is formed into a dome shape protruding to the inlet side of the recessed part 10. |
