发明名称 MECHANISM FOR MITIGATING HIGH HEAT-FLUX CONDITIONS IN A THERMOSIPHON EVAPORATOR OR CONDENSER
摘要 The present disclosure relates to systems, devices, and methods that augment a thermosiphon system (10) with a thermally conductive matrix material to increase the surface area to volume ratio for heat conduction at a predetermined region(s) of the thermosiphon system while minimizing capillary forces that are isolated to those region(s). The thermosiphon system has tubing including a condenser region (22), an evaporator region (24), and an adiabatic region (26) (e.g., a region between the condenser and evaporator regions). The tubing can contain a heat transport medium and can provide passive two-phase transport of the heat transport medium between the condenser and evaporator regions according to thermosiphon principles. The system also includes a thermally conductive matrix material contained in the condenser region and/or the evaporator region but not in the adiabatic region, such that the thermally conductive matrix material increases a surface area for heat transfer in the condenser region and/or the evaporator region.
申请公布号 EP3099986(A1) 申请公布日期 2016.12.07
申请号 EP20150704166 申请日期 2015.01.28
申请人 Phononic Devices, Inc. 发明人 EDWARDS, Jesse W.;ALLEN, Robert B.;SWANN, Daniel
分类号 F25B23/00;F28D15/02;F28F13/00;H05K7/20 主分类号 F25B23/00
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