| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board which manufactures a wiring board incorporating electronic components thereinto without deforming a core substrate.SOLUTION: A manufacturing method of a wiring board includes the steps of: forming an opening 46 on a core substrate 40; placing a resin sheet 48 on a lower surface of the core substrate 40; hearing a part of the resin sheet 48 and bonding the resin sheet 48 to one region of the core substrate 40 which excludes the opening 46; storing an electronic component 54 in the opening 46 of the core substrate 40; placing a resin sheet 56 on an upper surface of the core substrate 40; and heating the entire resin sheets 48, 56 and sealing the core substrate 40 by a resin 58 from the upper surface and the lower surface. |
