发明名称 |
METHOD AND DEVICE FOR CONNECTING TWO MILLIMETRIC ELEMENTS |
摘要 |
A process and a device for bonding two millimeter elements. The process makes, at determined locations of each of the two millimeter elements, bonding zones set to the potential of a second plane. Then, the process makes the bond by determined connections between the bonding zones and between conducting lines of the two millimeter elements. The device includes a coplanar line. Such a process and device may find particular application to millimeter circuits implementing conducting lines of the microstrip type. |
申请公布号 |
EP0983616(A1) |
申请公布日期 |
2000.03.08 |
申请号 |
EP19980925729 |
申请日期 |
1998.05.15 |
申请人 |
THOMSON-CSF |
发明人 |
CACHIER, GERARD;DADEN, JEAN-YVES;GRANCHER, ALAIN |
分类号 |
H01P1/04;H05K1/02;H05K1/14 |
主分类号 |
H01P1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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