METHODS AND SYSTEM FOR CONNECTING INTER-LAYER CONDUCTORS AND COMPONENTS IN 3D STRUCTURES, STRUCTURAL COMPONENTS, AND STRUCTURAL ELECTRONIC ELECTROMAGNETIC AND ELECTROMECHANICAL COMPONENTS/DEVICES

摘要

The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.