| 摘要 |
The central leaf (4) of the card is formed with a rectangular section opening (5) of a size to accommodate the micro-chip (2). A spiral metal antennae (3) is formed on the surface of the leaf and runs across the opening (5) to provide contact (3a,3b) with the chip electrodes (7,8). Connection is effected with solder additions (7a,7b). Outer leaves (9,10) are added and pressed under heat to form a single card with no air gaps around the interface connections. |
