| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the packing density on a multilayer ceramic substrate formed by laminating a plurality of ceramic green sheets upon another through making the surface of the substrate usable as a parts mounting surface and incorporating a resistor having a resistance value adjusted by trimming in the substrate. SOLUTION: A multilayer ceramic substrate is formed by laminating only green ceramic sheets 1 which are positioned under a green ceramic sheet 1 for forming an incorporated resistor 3 upon another, so that the green ceramic sheet 1 for forming the resistor 3 is positioned on the outermost surface of the laminated body. Then a lower substrate layer 2 is formed by baking the laminated green sheets 1. After the formation of the layer 2, the resistor 3 and electrode 4 are formed on the layer 2 through printing and baking. For the circuits in the layers underlying the outermost layer of the layer 2, via holes 6 exposed on the surface of the layer 2 are connected electrically to a conductor ink printed as the electrodes of the resistor 3. Then the resistance value of the resistor 3 is adjusted by trimming, such as the laser trimming. Finally, a body of green ceramic sheets 5 is laminated and then stuck to the baked lower substrate layer 2.</p> |
