发明名称 半導体装置の作製方法及び半導体装置
摘要 PROBLEM TO BE SOLVED: To manufacture a fine transistor with a high yield while suppressing gate insulator film shrinkage and damage.SOLUTION: A semiconductor device comprises: a semiconductor film on an insulating surface; a gate insulator on the semiconductor film; a gate electrode formed on the gate insulator and having a first metal film and a second metal film above the first metal film; and a metal oxide film formed on the gate insulator to be in contact with a side surface of the first metal film and having the same metal element as a metal element in the first metal film. The first metal film has larger ionization tendency than the second metal film.
申请公布号 JP6039150(B2) 申请公布日期 2016.12.07
申请号 JP20150160928 申请日期 2015.08.18
申请人 株式会社半導体エネルギー研究所 发明人 野田 耕生
分类号 H01L21/336;H01L21/28;H01L21/8242;H01L21/8247;H01L27/108;H01L27/115;H01L29/423;H01L29/49;H01L29/786;H01L29/788;H01L29/792 主分类号 H01L21/336
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