| 发明名称 |
METHOD FOR BONDING USING ADHESIVE LAYERS WITH THE AID OF A LASER |
| 摘要 |
The invention relates to a method and a device for bonding two substrates, wherein an adhesive is applied to a first substrate and a second film-type substrate consisting of a thermoplastic material is converted into a plasticized state by heating before being bonded to the first substrate. |
| 申请公布号 |
EP3099757(A1) |
申请公布日期 |
2016.12.07 |
| 申请号 |
EP20150700213 |
申请日期 |
2015.01.09 |
| 申请人 |
Henkel AG & Co. KGaA;Trumpf Laser- und Systemtechnik GmbH |
发明人 |
KINZELMANN, Hans-Georg;BLODAU, Marcel;SAUTER, Martin;BERGER, Michael |
| 分类号 |
C09J5/04;B32B37/12;C08J5/12;C09J5/06 |
主分类号 |
C09J5/04 |
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