发明名称 VESSEL FOR HOUSING ELECTRONIC COMPONENT
摘要 <p>PROBLEM TO BE SOLVED: To allow an electronic component to normally and stably operate for a long time by completing the airtight sealing of a vessel constituted of an insulating substance and a cover, surely and strongly fixing the electronic component to be housed in the vessel, and effectively preventing the generation of oxide corrosion on an electrode on the surface of the electronic component. SOLUTION: In this vessel, an insulating substance 1 is connected via a sealing member 7 with a cover 2, and an electronic component 3 is air-tightly housed in a vessel 4 constituted of the insulating substrate 1 and the cover 2. In this case, the sealing member 7 is formed of glass obtained by adding 10-40% by weight of titanate system compound as a filler to glass components including 5-25% by weight of lead oxide, 20-40% by weight of oxide tin, 20-40% by weight of lead fluoride, and 5-20% by weight of phosphorus pentoxide.</p>
申请公布号 JPH1131753(A) 申请公布日期 1999.02.02
申请号 JP19970185295 申请日期 1997.07.10
申请人 KYOCERA CORP 发明人 SHIBATA TAKASHI
分类号 H01L23/10;(IPC1-7):H01L23/10 主分类号 H01L23/10
代理机构 代理人
主权项
地址