| 摘要 |
PROBLEM TO BE SOLVED: To perform matching deviation measurement in laminated semiconductor chips accurately, in a short time and further without requiring skill.SOLUTION: A semiconductor device comprises: two laminated semiconductor chips 101, 121; a group of first metal bumps 111-119 aligned and provided side by side at a first interval on one of opposing surfaces of the two semiconductor chips 101, 121; a group of second metal bumps 131-139 aligned at a second interval different from the first interval on the other of the opposing surfaces of the two semiconductor chips and provided side by side at positions where a connection resistance value with the first metal bumps is changed in accordance with deviation of overlapping in the state where the two semiconductor chips are overlapped; and wires 102-110 and 122 for extracting coupled connection resistance values generated by the first metal bumps and the second metal bumps which are brought into contact with one another in the state where the two semiconductor chips are overlapped. |
