| 摘要 |
PROBLEM TO BE SOLVED: To provide an LED package, an LED light emitting element and a manufacturing method thereof capable of preventing leakage of sealing resin from the package and permeation of sulfide into a cavity.SOLUTION: The manufacturing method of an LED package includes the steps of: in a pair of lead frames 101 and 102 including one plane for mounting an LED chip, forming a coarse portion and a metal oxide layer in a boundary (C-portion) between a pair of connection surfaces (B-portion) which is the other plane opposite to the one plane where a pair of lead frames are opposite to each other; and forming an insulation portion for insulating and fixing between a pair of connection surfaces having metal oxide layer at the connection end when forming the coarse portion and the metal oxide layer. |
