| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having an insulation resin layer as the semiconductor device and capable of exhibiting sufficient reliability and connection reliability.SOLUTION: A semiconductor device comprises: a first substrate having a first terminal; a second substrate having a second terminal; and a junction part bonding the first terminal and the second terminal, and the insulation resin layer is formed from the resin composition containing at least of filler and the filler derived from the resin composition, is included in the junction part.SELECTED DRAWING: Figure 2 |
