发明名称 TREATMENT OF A SURFACE MODIFICATION LAYER FOR CONTROLLED BONDING OF THIN SHEETS WITH CARRIERS
摘要 A method of controllably bonding a thin sheet to a carrier, wherein the thin sheet has a thin sheet bonding surface, and the carrier has a carrier bonding surface. Depositing a surface modification layer onto at least one of the thin sheet bonding surface and the carrier bonding surface so as to obtain a first surface energy on the one of the thin sheet bonding surface and the carrier bonding surface. Then, treating the surface modification layer so as to change the first surface energy to a second surface energy, wherein the second surface energy is greater than the first. And bonding the thin sheet bonding surface to the carrier bonding surface via the surface modification layer. Depositing the surface modification layer, and treating it, may be done by plasma polymerization processes.
申请公布号 EP3099484(A1) 申请公布日期 2016.12.07
申请号 EP20150703682 申请日期 2015.01.27
申请人 Corning Incorporated 发明人 BELLMAN, Robert Alan;BOOKBINDER, Dana Craig;CHANG, Theresa;LIU, Shiwen;MANLEY, Robert George;MAZUMDER, Prantik
分类号 B32B17/06;B32B7/06;C03C17/28;C03C27/06;C23C16/56 主分类号 B32B17/06
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