发明名称 Method of fabricating a circuit board
摘要 Example methods of fabricating a circuit board are disclosed. An example method includes providing a substrate, forming at least one or more channels having linear nanostructures on the substrate, and forming a first electrode and a second electrode on the substrate, where the at least one or more channels electrically couple the first electrode to the second electrode.
申请公布号 US9596762(B2) 申请公布日期 2017.03.14
申请号 US201213365115 申请日期 2012.02.02
申请人 SNU R&DB FOUNDATION 发明人 Hong Seung Hun;Lee Min Baek
分类号 H05K3/02;H05K3/10;H05K1/16;B82Y10/00;H05K3/12 主分类号 H05K3/02
代理机构 Dorsey & Whitney LLP 代理人 Dorsey & Whitney LLP
主权项 1. A method of fabricating a circuit board, the method comprising: providing a substrate; forming a plurality of channels including linear nanostructures on the substrate; and forming a first electrode and a second electrode on the substrate and allowing the plurality of channels to electrically couple the first electrode to the second electrode, wherein the forming of the plurality of channels including the linear nanostructures on the substrate comprises: forming a nonpolar molecular layer pattern on the substrate; and forming the plurality of channels by self-assembling the linear nanostructures on an exposed region of the substrate that is not covered by the nonpolar molecular layer pattern, wherein forming of the plurality of channels by self-assembling the linear nanostructures on the exposed region of the substrate that is not covered by the nonpolar molecular layer pattern comprises immersing the substrate in a solution including the linear nanostructures.
地址 Seoul KR