| 发明名称 | Electrochemical deposition method | ||
| 摘要 | The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member. | ||
| 申请公布号 | US9593430(B2) | 申请公布日期 | 2017.03.14 |
| 申请号 | US201615180477 | 申请日期 | 2016.06.13 |
| 申请人 | EBARA CORPORATION | 发明人 | Yoshioka Junichiro;Horie Kuniaki;Guo Yugang;Morikami Satoshi |
| 分类号 | C25D17/00;C25D7/12;H01L21/687;H01L21/683;H01L21/288;H01L23/00;C25D17/06;C25D21/12;H01L21/67;C25D17/08;H01L21/768 | 主分类号 | C25D17/00 |
| 代理机构 | Wenderoth, Lind & Ponack, L.L.P. | 代理人 | Wenderoth, Lind & Ponack, L.L.P. |
| 主权项 | 1. A substrate holder for holding a substrate having a surface to be electroplated, said substrate holder comprising: a fixed holding member and a movable holding member for holding the substrate therebetween; and a first sealing member, mounted to the movable holding member, for making pressure contact with a peripheral portion of the substrate to seal the peripheral portion, wherein the first sealing member is a multi-seal structure comprising at least two loop-shaped sealing portions and partition sealing portions, the partition sealing portions extending in a width direction and arranged at locations along a circumferential direction of the at least two loop-shaped sealing portions. | ||
| 地址 | Tokyo JP | ||