发明名称 |
Silica for CMP, aqueous dispersion, and process for producing silica for CMP |
摘要 |
To reduce scratches during polishing while ensuring an appropriately high polishing rate, provided are a silica for CMP satisfying the following (A) to (C), an aqueous dispersion using a silica for CMP, and a method of producing a silica for CMP: (A) a BET specific surface area of 40 m2/g or more and 180 m2/g or less; (B) a particle density measured by a He-gas pycnometer method of 2.24 g/cm3 or more; and (C) a coefficient of variation in primary particle diameter calculated by TEM/image analysis of 0.40 or less. |
申请公布号 |
US9593272(B2) |
申请公布日期 |
2017.03.14 |
申请号 |
US201414904565 |
申请日期 |
2014.07.10 |
申请人 |
TOKUYAMA CORPORATION |
发明人 |
Nakamura Masahiro;Ishimoto Ryuji |
分类号 |
C09K13/00;C09K3/14;B24B37/00;H01L21/321;C01B33/18;B24B37/04 |
主分类号 |
C09K13/00 |
代理机构 |
Cantor Colburn LLP |
代理人 |
Cantor Colburn LLP |
主权项 |
1. A silica for CMP, which satisfies the following (A) to (C):
(A) a BET specific surface area of 40 m2/g or more and 180 m2/g or less; (B) a particle density measured by a He-gas pycnometer method of 2.24 g/cm3 or more; and (C) a coefficient of variation in primary particle diameter calculated by TEM/image analysis of 0.40 or less. |
地址 |
Yamaguchi JP |