| 摘要 |
An adhesive film, which can be bonded when heat-activated, comprising a) a polymer-metal blend comprising at least one adhesive which can be bonded when heat-activated, and at least one metal component melting in the temperature range from 50° C. to 400° C., and b) at least one fibrous, electrically conductive filler, the filler being present at least partly in the form of a bound fiber network with the metal component. |
| 主权项 |
1. An adhesive film, bondable when heat-activated, comprising
a) a polymer-metal blend comprising
at least one adhesive, bondable when heat-activated, andat least one metal component meltable in the temperature range from 50° C. to 400° C., and b) at least one fibrous, electrically conductive filler,
wherein the at least one fibrous, electrically conductive filler is present, at least partly, in a form of a bound fiber network with the at least one metal component such that fibers of the at least one fibrous, electrically conductive filler are present in a form bound to one another by the at least one metal component, andfurther wherein the at least one fibrous, electrically conductive filler comprises aluminum, copper, silver, gold, nickel, mu-metal, alnico, permalloy, ferrite, carbon nanotubes and graphene. |
