LED package and method for manufacturing the LED package

摘要

A LED package (10) for use in a lamp as well as a method for manufacturing such kind of a LED package (10) are provided, wherein the LED package (10) comprises at least one LED (16), an optical element (18) for guiding light emitted by the LED (16), a cover (26) for covering at least partially electrical components (20, 22, 24) connectable to the LED (16) and at least one optical detectable reference mark (32; 36), wherein the optical element (18) comprises at least one first optical detectable mark (30) and the cover (26) comprises at least one second optical detectable mark (34), whereby the optical element (18) and the cover (26) are arranged and aligned both with respect to the same reference mark (32; 36) by means of the first mark (30) and the second mark (34). Due to the same reference (32; 36) for both the optical element (18) and the cover (26) manufacturing tolerances are not added to each other so that the accuracy of a correct arrangement is increased. Thus, the LED package (10) provides an improved optical performance, particularly an improved brightness and an improved luminous flux.

主权项

1. A device comprising an LED package, the LED package comprising:
at least one LED mounted over a base; an optical element mounted over the LED and over the base, the optical element configured to guide light emitted by the LED; a cover mounted over the base and at least partially covering electrical components connected to the LED, wherein the cover is laterally spaced from the optical element to create a gap between the cover and the optical element; and a plurality of optically detectable reference marks on the base that remain optically detectable within the gap after the optical element and the cover are positioned, wherein the optical element includes a plurality of first optically detectable marks that are optically detectable along with the reference marks on the base within the gap, and the cover includes a plurality of second optically detectable marks that are optically detectable along with the reference marks on the base within the gap, wherein both the optical element and the cover are arranged and aligned with respect to the same optically detectable reference marks on the base via the first optically detectable marks and the second optically detectable marks, respectively, wherein the cover further comprises at least three alignment protrusions on its top surface, forming the highest points of the LED package, for concurrently contacting a reference surface during positioning of the package in a housing for positioning the package at a correct height in the housing.