| 发明名称 | Patterned conductive structure and method for forming the same | ||
| 摘要 | A method for forming a patterned conductive structure is provided. The method includes forming a soluble layer on a surface of a substrate, wherein the soluble layer has an opening exposing a rough portion of the surface. A first conductive layer is formed on the soluble layer, wherein the first conductive layer extends onto the rough portion in the opening. The soluble layer and the first conductive layer on the soluble layer are removed, wherein a portion of the first conductive layer corresponding to the rough portion is remained on the substrate. A patterned conductive structure formed by the method is also provided. | ||
| 申请公布号 | US9595754(B2) | 申请公布日期 | 2017.03.14 |
| 申请号 | US201414583446 | 申请日期 | 2014.12.26 |
| 申请人 | Wistron NeWeb Corp. | 发明人 | Radi Babak;Lu Yong-Jyun;Chiu Ming-Chi;Hsu Chien-Min;Chen Shih-Hong |
| 分类号 | H01Q1/38;H05K3/04;H05K3/14;H05K3/16;H05K1/03;H05K3/38;H01Q1/22 | 主分类号 | H01Q1/38 |
| 代理机构 | Muncy, Geissler, Olds & Lowe, P.C. | 代理人 | Muncy, Geissler, Olds & Lowe, P.C. |
| 主权项 | 1. A method for forming a patterned conductive structure, comprising: forming a soluble layer on a surface of a substrate, wherein the soluble layer has an opening exposing a rough portion of the surface of the substrate; forming a first conductive layer on the soluble layer, wherein the first conductive layer extends onto the rough portion in the opening; and removing the soluble layer and the first conductive layer on the soluble layer, wherein a portion of the first conductive layer corresponding to the rough portion is remained on the substrate. | ||
| 地址 | Hsinchu TW | ||