| 摘要 |
An in situ method for forming a thermally conductive thermal radical cure silicone composition is provided. The in situ method comprises forming a thermally conductive clustered functional polymer comprising the reaction product of a reaction of a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups; a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and a reactive species having, per molecule, at least 1 aliphatically unsaturated organic group and 1 or more curable groups; in the presence of a filler treating agent, a filler comprising a thermally conductive filler, an isomer reducing agent, and a hydrosilylation catalyst. The method further comprises blending the thermally conductive clustered functional polymer with a radical initiator. |
| 主权项 |
1. A method for forming a thermally conductive thermal radical cure silicone composition, the method comprising:
(a) forming a thermally conductive clustered functional polymer comprising the reaction product of a reaction of:
a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups,a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule,a reactive species having, per molecule, at least 1 aliphatically unsaturated organic group and 1 or more thermal radical curable groups,in the presence of a filler treating agent, a filler comprising a thermally conductive filler, an isomer reducing agent, and a hydrosilylation catalyst; and (b) blending the thermally conductive clustered functional polymer with a radical initiator to form the thermally conductive thermal radical cure silicone composition, wherein forming the thermally conductive clustered functional polymer of (a) comprises: (c) forming a first mixture comprising a thermally conductive filler, a filler treating agent, and a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups; (d) heating the first mixture to a temperature from 50° C. to 300° C. to treat the thermally conductive filler with the filler treating agent in the presence of the polyorganosiloxane; (e) cooling the first mixture to a temperature below 30° C.; (f) introducing the following components to the first mixture to form a second mixture:
a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per moleculea reactive species having, per molecule, at least 1 aliphatically unsaturated organic group and 1 or more thermal radical curable groups,an isomer reducing agent, anda hydrosilylation catalyst; (g) shearing the second mixture; and (h) heating the second mixture to a temperature ranging from 50° C. to 100° C. for a sufficient time such that substantially all of the Si—H groups of the second mixture have reacted. |
