发明名称
摘要 PURPOSE:To prevent oxidation of a conductive foil on a board by arranging a microwave strip line made of the copper foil on the surface of a fluororesin board at a prescribed interval and forming a solder layer to the copper foil. CONSTITUTION:The copper foils 9, 10 are formed on both sides of the board 1 using a fluororesin and the copper foil 9 on one side forms a strip line. The solder layers 11, 12 are plated on the surface of the copper foils 9, 10. Since the fluorine resin is deficient in the affinity with the solder, the solder plating is applied to the surface of the copper foil 9 while keeping an interval when the interval between the two strip lines 9 is >=30mum, and the change in the circuit constant is hardly caused. Through the constitution above, the oxidation of the conductive foil on the board is prevented with the simple method in this way.
申请公布号 JP2752966(B2) 申请公布日期 1998.05.18
申请号 JP19840041502 申请日期 1984.03.05
申请人 MATSUSHITA DENKI SANGYO KK 发明人 SETSUNE KENTARO;TANAKA TOSHIHIDE
分类号 H01P3/08;H05K3/22;H05K3/24;(IPC1-7):H01P3/08 主分类号 H01P3/08
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