Manufacturing method for component incorporated substrate and component incorporated substrate manufactured using the method

摘要

A manufacturing method for a component incorporated substrate according to the present invention includes positioning an electronic component with reference to a mark formed on a copper layer, the mark consisting of a material less easily etched than copper by a copper etching agent used for etching of copper, after mounting the electronic component on the copper layer with an adhesive layer interposed therebetween, embedding the electronic component and the mark in an insulating substrate, thereafter, etching and removing a part of the copper layer to form a window for exposing the mark, forming an LVH reaching a terminal of the electronic component with reference to the exposed mark, electrically connecting the terminal and the copper layer via a conduction via formed by applying copper plating to the LVH, and, thereafter, forming the copper layer into a wiring pattern.

主权项

1. A manufacturing method for a component incorporated substrate in which, in an insulating substrate including a wiring pattern on a surface, an electric or electronic component including a terminal electrically connected to the wiring pattern is incorporated, the manufacturing method comprising:
a mark forming step for forming a copper layer, which should be the wiring pattern, on a supporting plate and forming a mark on a second surface on an opposite side of a first surface in contact with the supporting plate of the copper layer; a component mounting step for positioning the component with reference to the mark and mounting the component on the second surface of the copper layer with an insulative adhesive layer interposed therebetween; an embedding layer forming step for forming, on the second surface of the copper layer on which the component is mounted, an embedding layer functioning as the insulating substrate in which the component and the mark are embedded; a window forming step for, after peeling the supporting plate off the copper layer, etching and removing, with a copper etching agent used for etching of copper, a part of the copper layer from the first surface of the copper layer exposed by the peeling and forming a window for partially exposing the embedding layer together with an entire proximal end face of the mark which was in contact with the second surface of the copper layer before removing the part of the copper layer; a conduction via forming step for specifying a position of a terminal of the component with reference to the mark exposed from the window and, after forming a via hole reaching the terminal, filling a conductive material in the via hole and forming a conduction via for electrically connecting the terminal and the copper layer; and a pattern forming step for forming the copper layer electrically connected to the terminal via the conduction via into the wiring pattern, wherein in the mark forming step, the mark is formed using an etching resistant material having greater etching resistance against etching by the copper etching agent than copper.