发明名称 Methods and apparatus for large diameter wafer handling
摘要 A front semiconductor opening wafer container for large diameter wafers includes a container portion and a door. The container portion includes a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers. The door is attachable to the container portion to close the open front and selectively latchable to the container portion. Optimized sag control is provided as well as enhanced structural rigidity, and wafer seating features.
申请公布号 US9592930(B2) 申请公布日期 2017.03.14
申请号 US201414558445 申请日期 2014.12.02
申请人 Entegris, Inc. 发明人 Gregerson Barry;Adams Michael S.;Steffens Jason T.
分类号 H01L21/673;B65D25/10;H01L21/677;B65D25/28;B65D43/02;B65D85/00 主分类号 H01L21/673
代理机构 Entegris, Inc. 代理人 Entegris, Inc.
主权项 1. A front opening wafer container for receiving a plurality of wafers positioned in a stacked array with a vertical axis, the container comprising: a container portion having closed lateral sides extending between a closed back and an open front and defining an open interior; a plurality of interconnected wafer supports disposed within said container portion and extending from proximate one of said closed lateral sides to proximate said closed back, said plurality of interconnected wafer supports defining a plurality of V-shaped grooves therebetween, each of said plurality of V-shaped grooves defining a first apex, where each of the plurality of interconnected wafer supports meet for registration of a respective one of a plurality of wafers therein, said first apex defining a first acute apex angle; and a back wafer restraint disposed within said container portion proximate said closed back, said back wafer restraint defining a plurality of V-shaped slots each defining a lower leg having an upward-facing engagement surface and an upper leg having a downward-facing engagement surface, each of said plurality of V-shaped slots defining a second apex where the lower leg and the upper leg of each of the plurality of V-shaped slots meet, the second apex in substantial planar alignment with said first apex of a corresponding one of said plurality of V-shaped grooves for registration of said respective one of said plurality of wafers, said second apex defining a second acute apex angle, wherein said second acute apex angle is less than said first acute apex angle.
地址 Billerica MA US
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