发明名称 Memory structure
摘要 The present invention relates to a memory structure, which is a kind of resistive memory. A middle layer formed by a first dielectric film and a second dielectric film is included between the top and bottom electrodes. The material of the top electrode is iridium oxide. Thereby, preferred oxygen vacancy filament paths can be provided and thus exhibiting complementary resistive switching of memory arrays. Furthermore, the memory structure can be applied to biological tests.
申请公布号 US9595565(B1) 申请公布日期 2017.03.14
申请号 US201615131262 申请日期 2016.04.18
申请人 Chang Gung University 发明人 Maikap Siddheswar;Samanta Subhranu
分类号 H01L27/24;H01L23/528;H01L45/00;H01L23/532 主分类号 H01L27/24
代理机构 Rosenberg, Klein & Lee 代理人 Rosenberg, Klein & Lee
主权项 1. A memory structure, comprising: a substrate; a plurality of word lines, disposed in parallel on said substrate; a plurality of bit lines, disposed in parallel on said substrate, perpendicular to the parallel direction of said plurality of word lines, interlacing with and covering said plurality of word lines at a plurality of cross points, and the material of said plurality of bit lines being iridium oxide, ruthenium oxide, platinum, palladium, cobalt, rhenium, rhodium, or graphene; and a plurality of middle layers disposed at said plurality of cross points and located between said plurality of word lines and said plurality of bit lines and including a first dielectric film and a second dielectric film arranged bottom-up sequentially;where the material of said second dielectric film is selected from the group consisting of gadolinium oxide, hafnium oxide, tantalum oxide, nickel oxide, zirconium oxide, chromium oxide, titanium oxide, tungsten oxide, cerium oxide, and germanium oxide; wherein a top surface of said plurality of bit lines includes a plurality of nanometer micro holes.
地址 Taoyuan TW