发明名称 Element housing package and mounting structure provided with same
摘要 An element housing package is provided with: a base plate including, on a top surface, a mounting region for mounting an element; a frame body disposed on the top surface of the base plate so as to surround the mounting region, the frame body including a through-hole; a connector disposed so as to pass through the through-hole T of the frame body and to extend from the inside to the outside of the frame body; a pedestal member disposed on the top surface of the base plate so as to be positioned in the frame body; and a wiring base plate bonded to a top surface of the pedestal member with a first bonding material placed therebetween and connected to the connector.
申请公布号 US9596779(B2) 申请公布日期 2017.03.14
申请号 US201414787880 申请日期 2014.08.27
申请人 Kyocera Corporation 发明人 Shirasaki Takayuki
分类号 H05K7/14;H01L23/057 主分类号 H05K7/14
代理机构 Volpe and Koenig, P.C. 代理人 Volpe and Koenig, P.C.
主权项 1. An element housing package comprising: a base plate comprising, on a top surface thereof, a mounting region for mounting an element; a frame body disposed on the top surface of the base plate so as to surround the mounting region, the frame body comprising a through-hole; a connector disposed so as to pass through the through-hole of the frame body and to extend from an inside to an outside of the frame body; a pedestal member disposed on the top surface of the base plate so as to be positioned in the frame body; and a wiring base plate bonded to a top surface of the pedestal member with a first bonding member placed between the wiring base plate and the top surface of the pedestal member and connected to the connector; a thickness of the frame body along a through direction of the through-hole being greater than a thickness of the base plate in a longitudinal section along the through direction; a width of the pedestal member being greater than a height of the pedestal member in the longitudinal section along the through direction of the through-hole; and a side surface of the pedestal member being bonded to an inner surface of the frame body with a second bonding material placed between the side surface of the pedestal member and the inner surface of the frame body, and a bottom surface of the pedestal member is not bonded to the top surface of the base plate.
地址 Kyoto JP
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