发明名称 |
Element housing package and mounting structure provided with same |
摘要 |
An element housing package is provided with: a base plate including, on a top surface, a mounting region for mounting an element; a frame body disposed on the top surface of the base plate so as to surround the mounting region, the frame body including a through-hole; a connector disposed so as to pass through the through-hole T of the frame body and to extend from the inside to the outside of the frame body; a pedestal member disposed on the top surface of the base plate so as to be positioned in the frame body; and a wiring base plate bonded to a top surface of the pedestal member with a first bonding material placed therebetween and connected to the connector. |
申请公布号 |
US9596779(B2) |
申请公布日期 |
2017.03.14 |
申请号 |
US201414787880 |
申请日期 |
2014.08.27 |
申请人 |
Kyocera Corporation |
发明人 |
Shirasaki Takayuki |
分类号 |
H05K7/14;H01L23/057 |
主分类号 |
H05K7/14 |
代理机构 |
Volpe and Koenig, P.C. |
代理人 |
Volpe and Koenig, P.C. |
主权项 |
1. An element housing package comprising:
a base plate comprising, on a top surface thereof, a mounting region for mounting an element; a frame body disposed on the top surface of the base plate so as to surround the mounting region, the frame body comprising a through-hole; a connector disposed so as to pass through the through-hole of the frame body and to extend from an inside to an outside of the frame body; a pedestal member disposed on the top surface of the base plate so as to be positioned in the frame body; and a wiring base plate bonded to a top surface of the pedestal member with a first bonding member placed between the wiring base plate and the top surface of the pedestal member and connected to the connector; a thickness of the frame body along a through direction of the through-hole being greater than a thickness of the base plate in a longitudinal section along the through direction; a width of the pedestal member being greater than a height of the pedestal member in the longitudinal section along the through direction of the through-hole; and a side surface of the pedestal member being bonded to an inner surface of the frame body with a second bonding material placed between the side surface of the pedestal member and the inner surface of the frame body, and a bottom surface of the pedestal member is not bonded to the top surface of the base plate. |
地址 |
Kyoto JP |