发明名称 Lens mount with conductive glue pocket for grounding to a circuit board
摘要 A lens mount is attached to a circuit board and covers electrical components on the circuit board. An electrically insulating device is positioned between the lens mount and the circuit board. The circuit board includes a grounding pad adjacent the electrically insulating device. The lens mount includes an aperture aligned with the grounding pad and the electrically insulating device. A conductive glue is dispensed into the aperture to electrically ground the lens mount to the grounding pad. The electrically insulating device seals the conductive glue from the electrical components. A method of grounding a lens mount to a circuit board is provided.
申请公布号 US9596748(B2) 申请公布日期 2017.03.14
申请号 US201313852373 申请日期 2013.03.28
申请人 STMicroelectronics Pte Ltd 发明人 Lim Wee Chin Judy
分类号 H05K1/02;H05K9/00 主分类号 H05K1/02
代理机构 Seed Intellectual Property Law Group LLP 代理人 Seed Intellectual Property Law Group LLP
主权项 1. A device, comprising: a circuit board having a first surface; a ground pad on the first surface of the circuit board; a sensor coupled to the first surface of the circuit board, spaced from the ground pad; a cover having a first surface and a second surface, the first surface of the cover being attached to the circuit board, the cover having an internal cavity and the sensor on the circuit board being within the internal cavity; at least one through hole extending through the cover from its first surface to its second surface, the at least one through hole facing the ground pad, the through hole having conductive sidewalls; a conductive glue positioned in the through hole on the ground pad, the conductive glue electrically coupling the cover to the ground pad of the circuit board; an insulation member; and the at least one through hole, the ground pad, and the insulation member sealing the conductive glue in the at least one through hole.
地址 Singapore SG