ADHESIVE COMPOSITION, ANISOTROPICALLY ELECTROCONDUCTIVE ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, AND CONNECTED OBJECT

摘要

The present invention relates to an adhesive composition which comprises (a) a thermoplastic resin, (b) a radical-polymerizable compound, (c) a free-radical polymerization initiator, and (d) an epoxy resin containing no (meth)acryloyloxy group and which contains substantially no cationic polymerization hardener for the epoxy resin.