| 摘要 |
A semiconductor air-conditioning card comprises a semiconductor cooling chip (3), a cool-end heat dissipation fin (4), a warm-end heat dissipation fin (2) and a vapor chamber (6) having a solvent in a vacuum cavity. A cool surface of the cool-end heat dissipation fin (4) and a cool surface of the semiconductor cooling chip (3) are connected, a warm surface of the semiconductor cooling chip (3) is connected to one end of the vapor chamber (6) having a solvent in a vacuum cavity, and the warm-end heat dissipation fin (2) is connected to the other end of the vapor chamber (6) having a solvent in a vacuum cavity. |
