发明名称 |
ELECTROPLATING PROCESSOR WITH CURRENT THIEF ELECTRODE |
摘要 |
An electroplating processor has a head including a wafer holder, with the head movable to position a wafer in the wafer holder into a vessel holding a first electrolyte and having one or more anodes. A thief electrode assembly may be positioned adjacent to a lower end of the vessel, or below the anode. A thief current channel extends from the thief electrode assembly to a virtual thief position adjacent to the wafer holder. A thief electrode in the thief electrode assembly is positioned within a second electrolyte which is separated from the first electrolyte by a membrane. Alternatively, two membranes may be used with an isolation solution between them. The processor avoids plating metal onto the thief electrode, even when processing redistribution layer and wafer level packaging wafers having high amp-minute electroplating characteristics. |
申请公布号 |
WO2017040054(A1) |
申请公布日期 |
2017.03.09 |
申请号 |
WO2016US47586 |
申请日期 |
2016.08.18 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
WILSON, Gregory, J.;MCHUGH, Paul, R. |
分类号 |
C25D17/00;C25D5/16;C25D7/12;C25D17/06;C25D17/10;H01L21/288 |
主分类号 |
C25D17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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