发明名称 METHOD FOR MANUFACTURING A TRANSISTOR HAVING A SHARP JUNCTION BY FORMING RAISED SOURCE-DRAIN REGIONS BEFORE FORMING GATE REGIONS AND CORRESPONDING TRANSISTOR PRODUCED BY SAID METHOD
摘要 A transistor device is fabricated by growing an epitaxial layer of semiconductor material on a semiconductor layer and forming an opening extending through the epitaxial layer at a position where a gate is to be located. This opening provides, from the epitaxial layer, a source epitaxial region on one side of the opening and a drain epitaxial region on an opposite side of the opening. The source epitaxial region and a first portion of the semiconductor layer underlying the source epitaxial region are then converted into a transistor source region. Additionally, the drain epitaxial region and a second portion of the semiconductor layer underlying the drain epitaxial region are converted into a transistor drain region. A third portion of the semiconductor layer between the transistor source and drain regions forms a transistor channel region. A transistor gate electrode is then formed in the opening above the transistor channel region.
申请公布号 US2017069661(A1) 申请公布日期 2017.03.09
申请号 US201514887814 申请日期 2015.10.20
申请人 STMicroelectronics, Inc. 发明人 Zhang John Hongguang
分类号 H01L27/12;H01L29/06;H01L21/762;H01L21/84;H01L29/161;H01L29/20;H01L29/66;H01L29/08;H01L21/02 主分类号 H01L27/12
代理机构 代理人
主权项 1. A method, comprising: growing an epitaxial layer of semiconductor material on a semiconductor layer; forming an opening extending through said epitaxial layer of semiconductor material at a position where a transistor gate is to be located to provide, from said epitaxial layer of semiconductor material, a source epitaxial region on one side of said opening and a drain epitaxial region on an opposite side of said opening; applying an anneal temperature to both the source epitaxial region and a first portion of the semiconductor layer underlying the source epitaxial region to convert the source epitaxial region and the first portion into a transistor source region; applying an anneal temperature to both the drain epitaxial region and a second portion of the semiconductor layer underlying the drain epitaxial region to convert the drain epitaxial region and the second portion into a transistor drain region; wherein a third portion of the semiconductor layer between the transistor source region and transistor drain region forms a transistor channel region; and forming a transistor gate electrode in said opening above the transistor channel region.
地址 Coppell TX US