SEMICONDUCTOR DEVICES AND PACKAGES AND METHODS OF FORMING SEMICONDUCTOR DEVICE PACKAGES

摘要

Semiconductor device packages include first and second semiconductor dice in a facing relationship. At least one group of solder bumps is substantially along a centerline between the semiconductor dice and operably coupled with integrated circuitry of the first and second semiconductor dice. Another group of solder bumps is laterally offset from the centerline and operably coupled only with integrated circuitry of the first semiconductor die. A further group of solder bumps is laterally offset from the centerline and operably coupled only with integrated circuitry of the second semiconductor die. Methods of forming semiconductor device packages include aligning first and second semiconductor dice with active surfaces facing each other, the first and second semiconductor dice each including bond pads along a centerline thereof and additional bond pads laterally offset from the centerline thereof.

主权项

1. A method of forming a semiconductor device package, the method comprising:
securing a back side of a first semiconductor die to a substrate, the first semiconductor die comprising bond pads over an active surface and along a centerline thereof and additional bond pads over the active surface and laterally offset from the centerline thereof; aligning a second semiconductor die with the first semiconductor die with an active surface of the second semiconductor die facing the active surface of the first semiconductor die, the second semiconductor die comprising bond pads over the active surface and along a centerline thereof and additional bond pads over the active surface and laterally offset from the centerline thereof, the aligning comprising:
substantially aligning the bond pads along respective centerlines of the first and second semiconductor dice with each other; and physically and electrically coupling the bond pads along the centerline of the first semiconductor die with the bond pads along the centerline of the second semiconductor die using conductive elements.