| 摘要 |
The purpose of the present invention is: to provide a positive-type photosensitive resin composition with which it is possible to obtain a cured resin pattern having high sensitivity to the i-line of a mercury lamp, excellent chemical resistance to strongly acidic aqueous solutions and strongly alkaline aqueous solutions, and, in particular, highly reliable adhesion to aluminum pads even in an electroless plating step after O2 ashing; and to provide a resin pattern using the composition, and a method for manufacturing a semiconductor device in which the same is used. The positive-type photosensitive resin composition contains (a) an alkali-soluble resin and (b) a quinonediazide compound, the alkali-soluble resin (a) including: (a1) a polyimide precursor in which the residue of a tetracarboxylic acid represented by general formula (1) is present in an amount of 5-50 mol% in relation to the total tetracarboxylic acid residue, the residue of a diamine represented by general formula (2) is present in an amount of 10-80 mol% in relation to the total diamine residue, and the residue of a diamine represented by general formula (3) is present in an amount of 10-90 mol% in relation to the total diamine residue; and/or (a2) a polyimide corresponding to (a1). (In general formula (1), A represents a tetravalent monocyclic or bicyclic aromatic hydrocarbon group free of heteroatoms, and two or more types may be used.) (In general formula (2), B represents a group selected from among O, S, SO2, CH2, CH(CH3), C(CH3)2, and C(CF3)2, and two or more types of these may be used.) |
