MICROELECTRONIC PACKAGE WITH HORIZONTAL AND VERTICAL INTERCONNECTIONS

摘要

In a microelectronic package, a first wire bond wire is coupled to an upper surface of a substrate. A first bond mass is coupled to another end of the first wire bond wire. A second wire bond wire is coupled to the upper surface. A second bond mass is coupled to another end of the second wire bond wire. The first and second wire bond wires laterally jut out horizontally away from the upper surface of the substrate for at least a distance of approximately 2 to 3 times a diameter of both the first wire bond wire and the second wire bond wire. The first wire bond wire and the second wire bond wire are horizontal for the distance with respect to being co-planar with the upper surface within +/−10 degrees.

主权项

1. A microelectronic package, comprising:
a substrate having an upper surface and a lower surface opposite the upper surface; a first wire bond wire of a first length coupled to the upper surface at a first end of the first wire bond wire; a first bond mass coupled to a second end of the first wire bond wire; a second wire bond wire of a second length coupled to the upper surface at a first end of the second wire bond wire; a second bond mass coupled to a second end of the second wire bond wire; the first wire bond wire and the second wire bond wire laterally jutting out horizontally away from the upper surface of the substrate for at least a distance of approximately 2 to 3 times a diameter of both the first wire bond wire and the second wire bond wire; and the first wire bond wire and the second wire bond wire being horizontal for the distance with respect to being co-planar with the upper surface within +/−10 degrees.