发明名称 MEMORY STRUCTURE
摘要 A memory structure is provided. The memory structure comprises M array regions and N contact regions. M is an integer ≧2. N is an integer ≧M. Each array region is coupled to at least one contact region. Each contact region comprises a stair structure and a plurality of contacts. The stair structure comprises alternately stacked conductive layers and insulating layers. Each contact is connected to one conductive layer of the stair structure. Two array regions which are adjacent to each other are spatially separated by two contact regions, which are coupled to the two array regions, respectively.
申请公布号 US2017069567(A1) 申请公布日期 2017.03.09
申请号 US201514845304 申请日期 2015.09.04
申请人 MACRONIX INTERNATIONAL CO., LTD. 发明人 Chen Shih-Hung
分类号 H01L23/528;G11C16/08;H01L27/115;H01L29/792;H01L29/788 主分类号 H01L23/528
代理机构 代理人
主权项 1. A memory structure, comprising: M array regions, wherein M is an integer ≧2; and N contact regions, wherein N is an integer ≧M, each of the M array regions is coupled to at least one of the N contact regions, and each of the N contact regions comprises: a stair structure comprising alternately stacked conductive layers and insulating layers; and a plurality of contacts, wherein each of the contacts is connected to one of the conductive layers of the stair structure; wherein two of the M array regions which are adjacent to each other are spatially separated by two of the N contact regions, which are coupled to the two of the M array regions, respectively.
地址 Hsinchu TW
您可能感兴趣的专利