| 发明名称 |
METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT |
| 摘要 |
A method of manufacturing a ceramic electronic component includes adding a modifier to a surface of chip containing ceramics and an organic material, applying a conductive paste on the surface of the chip to which the modifier has been added, and firing the chip along with the conductive paste applied on the chip. |
| 申请公布号 |
US2017069428(A1) |
申请公布日期 |
2017.03.09 |
| 申请号 |
US201615253979 |
申请日期 |
2016.09.01 |
| 申请人 |
Murata Manufacturing Co., Ltd. |
发明人 |
SHIMIZU Kotaro |
| 分类号 |
H01G4/30;H01G4/232;H01G4/248;H01G4/12 |
主分类号 |
H01G4/30 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a ceramic electronic component, the method comprising:
adding a modifier to a surface of a chip containing ceramics and an organic material; applying a conductive paste on the surface of the chip to which the modifier has been added; and firing the chip along with the conductive paste applied on the chip. |
| 地址 |
Nagaokakyo-shi JP |
