发明名称 THERMAL FEATURES OF A MOBILE DEVICE
摘要 This application relates to thermal management of a computing device using various features that can dissipate and direct thermal energy. In some embodiments, a thermal insert is set forth for separating a component from a cover glass of the computing device. The thermal insert can be attached to a frame of the computing device by insert molding the thermal insert to the frame. In other embodiments, a graphite strip can be disposed across different surfaces within the computing device in order to direct thermal energy away from a component of the computing device. In yet other embodiments, a thermal spreader and thermally conductive adhesive can be disposed over different surfaces of the computing device. For example, the thermal spreader and thermally conductive adhesive can be used to direct thermal energy away from a backlight of the computing device.
申请公布号 US2017068292(A1) 申请公布日期 2017.03.09
申请号 US201615146825 申请日期 2016.05.04
申请人 Apple Inc. 发明人 HOOTON Lee E.;SPRAGGS Ian A.;RAMMAH Marwan;REIGHTLER Seth;KAKUDA Tyler
分类号 G06F1/20;H05K7/20;G06F1/16 主分类号 G06F1/20
代理机构 代理人
主权项 1. A computing device having a component that outputs thermal energy, the computing device comprising: a frame comprising an opening; a thermal insert that at least partially closes the opening and is secured to the frame; and a cover glass coupled to the frame, wherein the thermal insert is configured to direct the thermal energy away from the cover glass.
地址 Cupertino CA US